Trends in Electronics Reliability Testing by Dr. John W. Sofia


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Trends in Electronics Reliability Testing

  • by

  • Dr. John W. Sofia


The Starting Point



Yesterday And Today



Heat Fluxes For Various Events



Moore’s Law



Driving Factors



CPU Power Trend



Relative Cooling Capability of Various Modes of Convective Heat Transfer and Coolants



Power Dissipation of CMOS Devices Vs. Clock Speed



Explosion in heat flux



CPU Heat Dissipation Over Time



Processor Performance Vs. Temperature



National Technology Roadmap For Semiconductors



Industry Trends

  • CMOS will continue to be the pervasive semiconductor technology for both memory and logic.

  • Chip sizes will increase, but circuit density will increase even more resulting in higher heat flux

  • Cost will become an increasingly significant challenge for future high-end cooling designs.

  • There will be increase emphasis on reducing design time.

  • The majority of new computer systems will most likely be air-cooled for the next few years.

  • The application of low temperature cooling as a means to achieve improved system performance may be expected to increase over the next few years.



Major Causes of Electronic Failures



Trends in Electronic Cooling



Trends in Electronic Interconnects



Trends in System Costs



Trends in Test Needs

  • Increasing challenges to avoid thermal & interconnect failure

  • Increasing needs (& budgets) for reliability testing



Analysis Tech Thermal and Interconnect Reliability Test Systems



Analysis Tech Test & Measurement Systems for Electronic Packaging Reliability




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