Optoelectronic Semiconductor Devices Principals and Characteristics

Figure 40.: Schematic illustration of chemical and physical etching. 
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8.3 PACKAGING 
Packaging is indispensable when optoelectronic devices are applied to equipment and systems. After 
packaging, optical input and output as well as electrical input and output can be performed via the optical 
ports and the electrical terminals. During packaging, bonding of the device chip on a heat sink or stem, 
for example, determines thermal conductance (or resistance), and the optical coupling between the device 
chip and the waveguide/fiber mainly determines the performance and reliability. 
The long-term stability of the plastic packages is determined by the properties of plastic materials Various 
plastics for packaging optical devices have been developed and some have been used in the modules for 
data links. 

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9 REFERENCES 
1. Chin-Lin Chen ''Elements of Optoelectronics and Fiber Optics''., School of Electrical and 
Computer Engineering, Purdue University, Irwin, Chicago, Bogota, Boston. 1996 
2. Coldren, L. A.; Corzine, S. W. ''Diode Lasers and Photonic Integrated Circuits'', University of 
California, Santa Barbara, California, John Wiley & Sons, Inc., New York, Toronto, Singapore; 
1995 
3. Kaminow, I.P; Eisenstein, G.; Stulz L.W.; Dentai A.G. '' Lateral confinement InGaAsP 
superluminescent diode at 1.3 mm.'' IEEE J. Quantum Electron. QE-19, (1983), pp. 78-82. 
4. Fukuda, M. ''Optical Semiconductor Devices'' John Wiley & Sons, Inc.; New York, Brisbane, 
Singapore, Toronto; 1999 
5. ''Reliability and Degradation of Semiconductor Lasers and LEDs.'' Artech House, Inc., Norwood, 
MA, USA 
6. Nuese, C.J.; Kressel, H.; Ladany I. ''The Future for LEDs.'' IEEE Spectrum, May 1972 pp.28-37. 
7. Gowar, J. ``Optical Communication Systems.''Prentice/Hall International, Englewood Cliffs, NJ, 
London, Singapore, Sydney, Toronto, 1984